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| Dispencing
Solutions |
| High
Speed Dispensers - MAX SERIES |
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 With
electronic assemblies becoming increasingly dense
and packages smaller than ever, electronics manufacturers
need the most accurate material deposition available,
for applications such as flip chip underfill, dam-and-fill,
glob top encapsulation and of course, glue for SMT
components. With the Non Contact Metering (NCM)
valve, the Mini Max (or Micro Max) can achieve a
practical throughput of over 40,000 Dots per hour.
The dispense systems collectively known as the MAX
Series are the premier dispensing platforms in the
GPD Global Dispensing line up. These dispense systems
are capable of a wide variety of dispense applications
including MicroVolume, Solder Paste and Conductive
Adhesive, Underfill, Surface Mount Adhesive, Encapsulations,
Masks, and Lens Fixing, to name a few. Each MAX
Series system has X,Y positional capability of +/-
0.001" (25 micron) and Z axis repeatability
of 0.0002" (5 micron). Utilizing a GPD Global
MAX Series dispense system allows you to expand
your process capability to new |
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| Easy
Valve Replacement |
Encapsulation |
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| T-Max
- Table Top Dispenser |
| T-Max
is an ideal system for companies with complex dispense
patterns, low volume production or those needing
to enhance their R&D capabilities while staying
within a moderate budget. GPD has developed the
intuitive FreeFLO software package for the T-Max.
Dots, lines, circles, gasket beads, plus other patterns
are easily programmed with the T-Max FreeFLO software,
Automatic vision alignment is available as an option. |
- Innovative, simple, programming user interface
- Incorporates intuitive FreeFLO software
- Compact footprint, yet large work area
- Versatile and simple set up
- Safety shields available
- Easy to Program
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| www.gpd-global.com |
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