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| Automatic
Optical Inspection SPOIS II |
| SPOISII
- In-Line Automatic Optical Inspection (AOI) |
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 Highly
Precise and Accurate In-Line AOI system from GMS,
Malaysia, SPOIS works on the principle of synthetic
modeling of components. SPOIS does not rely on comparator
principle of comparing all PCBs with the Golden
Board, thus avoiding false alarms. SPOIS has a unique
capability to detect defects at any stage of SMT
manufacturing. It can be placed after the Stencil
Printer to detect Printing defects, or after the
Placement equipment to detect Placement related
defects, or after the Reflow oven to detect Soldering
related defects. Priced much lower than conventional
Inline AOI systems, and slightly higher than the
conventional Table Top systems, SPOIS can achieve
ROI in record short times. The NG Marker (Optional)
can mark the defect on the PCB making it easier
for the Rework Operator to identify and rework the
defect. |
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| Simple
User Interface |
Print
Misalignment Detection |
Solder
Bridging Detection |
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| SPOISII
Specifications |
| Model |
SPOIS
II |
| Inspection
method |
Subpixel
Detection, HIS Color |
| Camera |
CCD
Color Camera |
| Resolution |
20
µ (standard), 25 µ (option1), 20 µ (option2) |
| View
Size |
24
x 32 mm (@20 µ), 31 x 42mm (@25 µ), 21 x 24mm (@17 µ) |
| Light |
3-Tier
White LED Light |
| Inspection
Time |
Approximately
0.5sec/frame |
| PCB
Size |
50
x 50mm ~ 250 x 330mm (L Size Optional) |
| Detect
Items (Solder Paste) |
Insufficient,
Excess, Misalignment, Bridging |
| Detect
Items (Placement/Soldering) |
Missing
component, Misalignment, Tombstone, Wrong Polarity, Bridging,
Fillet Check |
| Power
and Air |
AC
230V or 100V, 5Bar pressure |
| Dimensions
and weight |
720
x 765 x 1320mm (LxDxH) (M-Size), Approx. 300kg |
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| www.gmsspois.com |
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