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Assembléon
High End Pick & Place Solutions
Assembléon - iFlex
Flexible Pick & Place Solutions
TRI
Inspection & Test Equipment
Mirae
Mid Volume Component Mounters
Ambitec
Fully Automatic In-Line Stencil Printer
ETC
High End Reflow Ovens
NUTEK
Board Handling Systems
Ching Yi Technology
Precision Parts & Spares
Software Solutions
Automatic Gerber to Centroid Extraction Software
Mid Volume SMT Solutions
Stencil Printer & Lead Free Reflow Ovens
Pre-Owned Line Solutions
Low Cost, Low to High Volume SMT Line Solutions

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Assembléon A-Series
Unrivalled flexibility for the optimum line configuration
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Manufacturing an ever greater variety of electronic goods with an ever more limited shelf life, means faster product changeovers, fluctuating volumes and shorter times-to-market. Moreover, SMT Pick & Place Equipments/Machines require versatility to mix-and-match large or small batches, with low or high product mix, at an increasingly demanding quality levels - still keeping operating costs low without sacrificing performance levels. This is where the Assembléon A-Series comes in.

The AX-501, AX-301 and AX-201 introduce integrated functionality and high performance levels across a single, common platform offering the best Value of Ownership.

The AX-501 and AX-301 can be scaled up or down in small steps to the desired output capacity, without compromising placement accuracy. Next to the wide range of components from the smallest chips to large ICs, odd-form SMD components can also be handled.

The Assembléon A-Series machines share a common user interface, feeder range, trays, trolleys and placement heads.
   
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Component Range vs Output comparison Guaranteed Solutions. in a fast changing world
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AX-501 and AX301 (Scalable output, high first pass yield)

While maintaining their small footprint, the AX-301 and AX-501 can be scaled in small steps to desired output capacity between 49.5K and 165K components per hour (cph) (rated output), without compromising placement accuracy. They handle components from 01005 up to 45 x 45mm fine-pitch QFP, BGA, mBGA and CSP packages, and components up to 10.5mm tall, with a placement accuracy of 40 microns at 3 sigma. The AX-501 and AX-301 solutions hold up to 260 feeding lanes. Additionally, they handle feeder options such as tape feeders, stick feeders, tray feeders, bare die (wafer) feeders and bulk feeders, all without sacrificing board width or other feeder positions.
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AX-201 High placement accuracy, ultra wide component range
The AX-201offers a unique combination of high placement accuracy and an extremely wide component range while maintaining a fast placement rate. With a placement rate of up to 18k cph (rated output) and a placement accuracy of 20 microns at 3 sigma. It handles components from 01005 to large components, such as connectors up to 130 x 79mm. Furthermore, without compromise, it handles fine-pitch QFP, BGA, mBGA, CSP packages and components up to 40mm tall.
Assembléon A-Series Specification
Model AX-501 AX-301 AX-201
Maximum output per hour 165k 99k 18k
IPC 9850 output per hour 36k to 130k 36k to 78k 11k
Placing accuracy at 3 sigma 40 microns 40 microns 20 microns
Interspacing 80 microns 80 microns 80 microns
Component range 0.4 x 0.2mm (01005) to 45mm x 45mm 0.4 x 0.2mm (01005) to 45mm x 45mm 0.4 x 0.2mm (01005) to 130mm x 79mm
Maximum component height 10.5mm 10.5mm 40mm
Toolbit exchange Automatic nozzle exchange Automatic nozzle exchange Automatic nozzle exchange
Maximum board size (L x W) 515 x 390mm
515 x 457mm with restrictions
515 x 390mm
515 x 457mm with restrictions
515 x 457mm
Minimum board size (L x W) 50 x 50mm
50 x 25mm optional
50 x 50mm
50 x 25mm optional
50 x 50mm
50 x 25mm optional
Board thickness 0.3 to 6mm
10mm (optional)
0.3 to 6mm
10mm (optional)
0.3 to 6mm
10mm (optional)
Board transport direction Left-right, right-left Left-right, right-left Left-right, right-left
Feeding positions 260 twin tapes, 130 single tapes, 47 trays 1560 twin tapes, 78 single tapes, 47 trays 212 twin tapes, 106 single tapes, 376 trays
Placement force 1.5 to 8N 1.5 to 8N 0.9 to 40N
Lower force possible upon request
Footprint (L x W)
(incl. front side feeder trolleys)
3720 x 2285 mm 2760 x 2285mm 1852 x 2265mm
Single-sided operation yes yes yes
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PCB transport Placement Head High Accuracy
  • Automatic width adjustment
  • Automatic board thickness adjustment
  • Zero board loading and unloading time
  • Up to 10mm board thickness
  • Single type of Placement Head
  • Alignment on-the-fly for maximum output
  • Fiducial and artwork recognition
  • Automatic board warpage correction
  • Real-time placement force control
  • High accuracy of 40µm at 3 sigma
  • Package on Package applications
  • Bare Die applications
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