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| A-Series |
| Unrivalled flexibility for the optimum line configuration |
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Manufacturing an ever greater variety of electronic goods with an ever more limited shelf life, means faster product changeovers, fluctuating volumes and shorter times-to-market. Moreover, Pick & Place solutions require versatility to mix-and-match large or small batches, with low or high product mix, at an increasingly demanding quality levels - still keeping operating costs low without sacrificing performance levels. This is where the A-Series comes in.
The AX-501, AX-301 and AX-201 introduce integrated functionality and high performance levels across a single, common platform offering the best Value of Ownership.
The AX-501 and AX-301 can be scaled up or down in small steps to the desired output capacity, without compromising placement accuracy. Next to the wide range of components from the smallest chips to large ICs, odd-form SMD components can also be handled.
The A-Series machines share a common user interface, feeder range, trays, trolleys and placement heads. |
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| Component Range vs Output comparison |
Guaranteed Solutions. in a fast changing world |
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AX-501 and AX301 (Scalable
output, high first pass yield)
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| While maintaining their small footprint, the AX-301 and AX-501 can be scaled in small steps to desired output capacity between 49.5K and 165K components per hour (cph) (rated output), without compromising placement accuracy. They handle components from 01005 up to 45 x 45mm fine-pitch QFP, BGA, mBGA and CSP packages, and components up to 10.5mm tall, with a placement accuracy of 40 microns at 3 sigma.
The AX-501 and AX-301 solutions hold up to 260 feeding lanes. Additionally, they handle feeder options such as tape feeders, stick feeders, tray feeders, bare die (wafer) feeders and bulk feeders, all without sacrificing board width or other feeder positions. |
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AX-201 High placement accuracy, ultra wide component range |
| The AX-201offers a unique combination of high placement accuracy and an extremely wide component range while maintaining a fast placement rate. With a placement rate of up to 18k cph (rated output) and a placement accuracy of 20 microns at 3 sigma. It handles components from 01005 to large components, such as connectors up to 130 x 79mm. Furthermore, without compromise, it handles fine-pitch QFP, BGA, mBGA, CSP packages and components up to 40mm tall. |
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| A-series Specification |
| Model |
AX-501 |
AX-301 |
AX-201 |
| Maximum output per hour |
165k |
99k |
18k |
| IPC 9850 output per hour |
36k to 130k |
36k to 78k |
11k |
| Placing accuracy at 3 sigma |
40 microns |
40 microns |
20 microns |
| Interspacing |
80 microns |
80 microns |
80 microns |
| Component range |
0.4 x 0.2mm (01005) to 45mm x 45mm |
0.4 x 0.2mm (01005) to 45mm x 45mm |
0.4 x 0.2mm (01005) to 130mm x 79mm |
| Maximum component height |
10.5mm |
10.5mm |
40mm |
| Toolbit exchange |
Automatic nozzle exchange |
Automatic nozzle exchange |
Automatic nozzle exchange |
| Maximum board size (L x W) |
515 x 390mm
515 x 457mm with restrictions |
515 x 390mm
515 x 457mm with restrictions |
515 x 457mm |
| Minimum board size (L x W) |
50 x 50mm
50 x 25mm optional |
50 x 50mm
50 x 25mm optional |
50 x 50mm
50 x 25mm optional |
| Board thickness |
0.3 to 6mm
10mm (optional) |
0.3 to 6mm
10mm (optional) |
0.3 to 6mm
10mm (optional) |
| Board transport direction |
Left-right, right-left |
Left-right, right-left |
Left-right, right-left |
| Feeding positions |
260 twin tapes, 130 single tapes, 47 trays |
1560 twin tapes, 78 single tapes, 47 trays |
212 twin tapes, 106 single tapes, 376 trays |
| Placement force |
1.5 to 8N |
1.5 to 8N |
0.9 to 40N
Lower force possible upon request |
Footprint (L x W)
(incl. front side feeder trolleys) |
3720 x 2285 mm |
2760 x 2285mm |
1852 x 2265mm |
| Single-sided operation |
yes |
yes |
yes |
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| PCB transport |
Placement Head |
High Accuracy |
- Automatic width adjustment
- Automatic board thickness adjustment
- Zero board loading and unloading time
- Up to 10mm board thickness
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- Single type of Placement Head
- Alignment on-the-fly for maximum output
- Fiducial and artwork recognition
- Automatic board warpage correction
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- Real-time placement force control
- High accuracy of 40µm at 3 sigma
- Package on Package applications
- Bare Die applications
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| www.assembleon.com |
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